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Atmospheric Pressure Plasma (AP Plasma)

Introduction

The atmospheric pressure Plasma method replaces the previous UV Lamp cleaning method (Excimer UV), which has high performance (about 4 times that of Excimer) surface modification effect and helps reduce running cost.

Description

  • Increase the initial cleaning effect of the substrate, the improvement of precision cleaning efficiency and the improvement of adhesion.
  • It is most suitable for upgrading sub-processes (ITO, PI, and photoresist coating before production) high adhesion surface modification.
  • Since the surface is uniform after treatment, the initial reaction of the developer, etching solution, and photoresist removal solution can be accelerated, and the processing consistency and processing speed can be effectively improved.
  • Non-contact low-temperature treatment and cleaning will not cause damage to the surface of the product (the same degree as UV and EUV), so it has no adverse effects on the device.
  • Installed in each process, can effectively remove the surface organic pollution layer.
  • During the processing, no static electricity will be generated on the surface of the substrate.
  • No electrostatic discharge (the ESD value after treatment is within 0~50V, due to the generation of positive and negative ions, there is no need for negative ion air purifiers before processing. Make the substrate uncharged.)

Spec:

Customized

Product Contact

Yu Ching Yang

Sales Dept.Ⅱ, Mechanical Equipment Div., 3rd Business Unit
Project Assistant Manager

TOPCO SCIENTIFIC CO.,LTD.

1F., No. 8, Chuangye Rd., Science Based Industrial Park, Sinshih District, Tainan City 744094, Taiwan
TEL: (06)505-8940 ext.6181
e-mail: yu.ching.yang@topco-global.com

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