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CMP PAD

Introduction

Hong Wu Technology has cooperated with Teijin in 2003 to develop the polishing pad market jointly, aiming to enhance the quality of silicon wafers and reduce production costs. Silicon wafer polishing pads are made of blended non-woven microfiber and polyurethane resin.

Description

According to the requirements of the wafer CMP process, develop and classify three main types of products.

a) Impregnated non-woven fabric type.
b) Polyurethane base on non-woven fabric or PET.
c) Polyurethane foam type.

Feature of our polishing pad

  • High removal rate and low defect rate
  • Machine table 6 inch ~ 56 inch
  • Specify baseline graphics (grooving)

Product Contact

Sam Lin

Sales Dept. Ⅲ, Wafer Material Div., 2nd Business Unit
Sales Assistant Manager

TOPCO SCIENTIFIC CO.,LTD.

4F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3413
e-mail: sam.lin@topco-global.com

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