According to the requirements of the wafer CMP process, develop and classify three main types of products.
a) Impregnated non-woven fabric type.
b) Polyurethane base on non-woven fabric or PET.
c) Polyurethane foam type.
Feature of our polishing pad
- High removal rate and low defect rate
- Machine table 6 inch ~ 56 inch
- Specify baseline graphics (grooving)