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CU Paste

Introduction

Used for the electrodes on chip components (MLCC)

Description

Details:

Sintered TYPE Copper PASTE
Productions are categorized depending on customer’s need.

Use:

Used for the electrodes on chip components (MLCC)

Spec:

The characteristics are adjusted depending on customers’ specification application.

Product Contact

Chris Lin

Electronics Div Ⅰ., 3rd Business Unit
Senior Manager

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.3113
e-mail: yoshi.lin@topco-global.com

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