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Cu pillar & Mass array solution

Introduction

  1. High length/diameter ratio for fine pitch application.
  2. High length character provides spacing to anti-warpage & large loading issue.
  3. Anti-EMI shielding effect by e-conductivity.

Description

  1. Cu pillar have high thermal-conductivity, high electric conductivity as  effective conducting material in high level semi-packaging.
  2. Cu pillar apply in semi-packaging as I/O connection could enhance the mobility of under-fill.
  3. High ratio(length/diameter) pillar could replace Cu-plating, fine solder ball by better processing-cost benefit.

Spec :

Minimum diameter : 70 um
Maximum length : 1 mm
Surface coating(1~15 um) : Ni、Au、Sn

Product Contact

Kim Lin

Electronics Div Ⅰ., 3rd Business Unit
Assistant Manager

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.3152
e-mail: chichin.lin@topco-global.com

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