- Cu pillar have high thermal-conductivity, high electric conductivity as effective conducting material in high level semi-packaging.
- Cu pillar apply in semi-packaging as I/O connection could enhance the mobility of under-fill.
- High ratio(length/diameter) pillar could replace Cu-plating, fine solder ball by better processing-cost benefit.
Minimum diameter : 70 um
Maximum length : 1 mm
Surface coating(1~15 um) : Ni、Au、Sn