- Diamond grit : Control the advanced separation and electroplating technology to realize the self-guarantee of diamond grit.
- Core wire : Cooperate with the core wire manufacturer both domestic and overseas to develop core wire with high tension & strength to realize the mass production of 50 um, 40 um, or even thinner silicon slicing DW.
- Electroplating liquid : Possess the on line monitoring system and recirculation purification technology to ensure the adhesion quality of diamond grit.
Main products :
|Type||EDW for PV/LED/Optics/Semiconductor industries|
|Specification||Diameter : 0.04 mm~0.45 mm|
|Cutting field||To slice silicon/sapphire/SiC ingot|
|R&D direction||．Less than 0.040 mm
．High speed cutting (for MB288S3, PV600DT, Takatori)
．Higher efficiency, lower wire consumption, Warp data
．For all kinds of cutting machine and cutting recipe