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Epoxy Mold Compound for IC Packaging

Introduction

Epoxy resin is a polymer thermosetting material, mainly used for IC and passive component packaging to protect internal chips from environmental damage and have an insulating effect.

Description

Use:

  • For IC Package encapsulating.
  • Diode
  • Transistor package

Spec:

  • 15kg/can
  • Low temperature storage: below 5 degrees Celsius

Product Contact

Jessica Liu

Sales Dept. I, Advanced Material Div. I, 1st Business Unit
Senior Specialist

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.2726
e-mail: jessica.liu@topco-global.com

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