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Advanced
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12 inch processed wafer carrier (FOUP)

Introduction

It can protect, transport, and store 12 inch wafers.

Shin-Etsu Polymer protects processed wafers at factories, provides safety protection and effectively reduces the risk of wafers being polluted by micro-particle.

Description

Purpose :

A carrier loading with 12 inch wafers for process running in clean room.

Features :

  • Single molded structure
  • Accurate dimensions specified in SEMI standard.
  • Higher interoperability. (has auto door to be opened automatically)
  • Entire shell is ESD (material PC+ carbon fiber to dissipate electric charge)
  • Good sealing performance

Spec:

Capacity : 25 pcs/set

Weight : 4.6kg/set

Dimension : W426mm x L347mm x H338mm

Shell : Conductive PC, PBT&PC (Rear Window)

Door (Inside) : PC Alloy

Door (Outside) : PC

SEMI Standard : Compliant (E47.1, E1.9, E15.1, E57, E62 and S8)

Options : Conductive side rails, Bar code & RF ID Tag holder, UV cut window & Card Case.

Product Contact

Mark Chen

Sales Dept. II, Engineering Integration Div., 5th Business Unit
Sales Manager

TOPCO SCIENTIFIC CO.,LTD.

6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3324
e-mail: mark.chen@topco-global.com

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