-Increase the initial cleaning effect of the substrate, the improvement of precision cleaning efficiency and the improvement of adhesion.
– It is most suitable for upgrading sub-processes (ITO, PI, and photoresist coating before production) high adhesion surface modification.
– Since the surface is uniform after treatment, the initial reaction of the developer, etching solution, and photoresist removal solution can be accelerated, and the processing consistency and processing speed can be effectively improved.
– Non-contact low-temperature treatment and cleaning will not cause damage to the surface of the product (the same degree as UV and EUV), so it has no adverse effects on the device.
– Installed in each process, can effectively remove the surface organic pollution layer
– During the processing, no static electricity will be generated on the surface of the substrate
– No electrostatic discharge (the ESD value after treatment is within 0~50V, due to the generation of positive and negative ions, there is no need for negative ion air purifiers before processing. Make the substrate uncharged)