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CMP Slurry

Introduction

Fujimi oxide, poly, W, Cu slurry for CMP process.

Description

Details:

Fujimi oxide, poly, W, Cu slurry for CMP process.

Use:

Oxide Slurry:PL-4101(STI),PL-4217系列(IMD)
Poly Slurry:PL-6103
W Slurry:PL-5201/PL-5107
Cu Slurry:PL-7102/PL-7104

Spec:

Drum Type: 220Kg
Bottle Type: 20Kg
Silica Base
Warranty: 1 year life time
Temperature: 0~43 Degree C.

Product Expert

Nick Han

Sales Dept. II, High Performance Material Div., 5th Busines Unit
Senior Manager

TOPCO SCIENTIFIC CO.,LTD.

6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3362
e-mail: cc.han@topco-global.com

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