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CMP Slurry

Introduction

Fujimi oxide, poly, W, Cu slurry for CMP process.

Description

Details:

Fujimi oxide, poly, W, Cu slurry for CMP process.

Use:

Oxide Slurry:PL-4101(STI),PL-4217系列(IMD)
Poly Slurry:PL-6103
W Slurry:PL-5201/PL-5107
Cu Slurry:PL-7102/PL-7104

Spec:

Drum Type: 220Kg
Bottle Type: 20Kg
Silica Base
Warranty: 1 year life time
Temperature: 0~43 Degree C.

Product Expert

Nick Chih-Cheng Han

Sales Dept. II, High Performance Material Div., 5th Busines Unit
Senior Manager

崇越科技股份有限公司

4F & 6F., No.12, Gongye E. 9th Rd., East Dist., Hsinchu City 300, Taiwan

TEL:(03)564-2132 ext.3362
e-mail:cc.han@topco-global.com