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CMP Slurry

Introduction

The company is the agent of Fujimi Inc. which is applied in the semiconductor CMP processes such as Oxide/Poly/W/Cu/TSV/Reclaim to achieve the best planarization performance.

Description

Use:

Oxide Slurry: PL-4101(STI)、 PL-4217系列(IMD)、PL-4219
Poly Slurry: PL-6103、PL-6108
W Slurry: PL-5201、PL-5107、PL-5111
Cu Slurry: PL-7102、PL-7104、PL-8105、PL-8110
TSV Slurry: DCM-B70
Reclaim Slurry: GL-3108

Spec:

Drum Type: 220 kg
Bottle Type: 20 kg
Silica Base
Warranty: 1 year life time
Temperature: 0~43℃

Product Contact

Nick Han

Sales Dept. II, High Performance Material Div., 5th Busines Unit
Senior Manager

TOPCO SCIENTIFIC CO.,LTD.

6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3362
e-mail: cc.han@topco-global.com

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