Integrative
Capabilities
Quality
Advanced
Production
Execution

Diamond Wire

Introduction

Diamond wire (DW) is regarded as the best cutting tools for the hard and brittle materials such as silicon for semiconductor, PV solar,  sapphire wafer, magnetic materials with high efficiency and low cost.

Description

  • Diamond grit : Control the advanced separation and electroplating technology to realize the self-guarantee of diamond grit.
  • Core wire : Cooperate with the core wire manufacturer both domestic and overseas to develop core wire with high tension & strength to realize the mass production of 50 um, 40 um, or even thinner silicon slicing DW.
  • Electroplating liquid : Possess the on line monitoring system and recirculation purification technology to ensure the adhesion quality of diamond grit.

Spec:

Main products :

Type EDW for PV/LED/Optics/Semiconductor industries
Specification Diameter : 0.04 mm~0.45 mm
Cutting field To slice silicon/sapphire/SiC ingot
R&D direction .Less than 0.040 mm
.High speed cutting (for MB288S3, PV600DT, Takatori)
.Higher efficiency, lower wire consumption, Warp data
.For all kinds of cutting machine and cutting recipe

Product Contact

Sam Lin

Sales Dept. Ⅲ, Wafer Material Div., 2nd Business Unit
Sales Assistant Manage

TOPCO SCIENTIFIC CO.,LTD.

4F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3413
e-mail: sam.lin@topco-global.com

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