Description
- Diamond grit : Control the advanced separation and electroplating technology to realize the self-guarantee of diamond grit.
- Core wire : Cooperate with the core wire manufacturer both domestic and overseas to develop core wire with high tension & strength to realize the mass production of 50 um, 40 um, or even thinner silicon slicing DW.
- Electroplating liquid : Possess the on line monitoring system and recirculation purification technology to ensure the adhesion quality of diamond grit.
Spec：
Main products :
| Type | EDW for PV/LED/Optics/Semiconductor industries |
| Specification | Diameter : 0.04 mm~0.45 mm |
| Cutting field | To slice silicon/sapphire/SiC ingot |
| R&D direction | ．Less than 0.040 mm ．High speed cutting (for MB288S3, PV600DT, Takatori) ．Higher efficiency, lower wire consumption, Warp data ．For all kinds of cutting machine and cutting recipe |
