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Epoxy Mold Compound for IC Packing

Introduction

Epoxy resin is a polymer thermosetting material, mainly used for IC and passive component packaging to protect internal chips from environmental damage and have an insulating effect.

Description

Use:

  • For IC Package encapsulating.
  • Diode
  • Transistor package

Spec:

  • 15kg/can
  • Low temperature storage: below 5 degrees Celsius

Product Expert

Ivy Yu

Sales Dept. I, Application Products Div., 1st Business Unit
Senior Manager

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.2754
e-mail: ivy.yu@topco-global.com

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