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Epoxy Mold Compound for IC Packing

Introduction

Epoxy resin is a polymer thermosetting material, mainly used for IC and passive component packaging to protect internal chips from environmental damage and have an insulating effect.

Description

Use:

  • For IC Package encapsulating.
  • Diode
  • Transistor package

Spec:

  • 15kg/can
  • Low temperature storage: below 5 degrees Celsius

Product Expert

Ivy Yu

Sales Dept. I, Application Products Div., 1st Business Unit
Department manager

TOPCO SCIENTIFIC

No.483, Sec. 2, Tiding Blvd., Neihu, Taipei City 114
TEL:(02)8797-8020 ext.2754
e-mail:ivy.yu@topco-global.com