Description
Use：
- For IC Package encapsulating.
- Diode
- Transistor package
Spec：
- 15kg/can
- Low temperature storage: below 5 degrees Celsius
Epoxy Mold Compound for IC Packing
Introduction
Epoxy resin is a polymer thermosetting material, mainly used for IC and passive component packaging to protect internal chips from environmental damage and have an insulating effect.
Product Expert
No.483, Sec. 2, Tiding Blvd., Neihu, Taipei City 114Ivy Yu
Sales Dept. I, Application Products Div., 1st Business Unit
Department managerTOPCO SCIENTIFIC
TEL:(02)8797-8020 ext.2754
e-mail:ivy.yu@topco-global.com
