Integrative
Capabilities
Quality
Advanced
Production
Execution

Flux

Introduction

Remove oxidation on metal surface, make good solder joint.

Description

  • Designed for die attach and ball attach
  • Excellent solderability and wetting
  • Clean well, no flux residue
  • Halogen free

Spec :

Syringe ( 30cc/150cc )

Product Contact

Posen Tseng

Electronics Div Ⅱ., 3rd Business Unit
Manager

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.3128
e-mail: posen.tseng@topco-global.com

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