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GaP substrate

Introduction

For high quality epiwafer and bonding support of high brightness LED wafer

Description

Use:

Hugle UPC-12100 is an automatic 300mm FOUP cleaning system using D.I water ultrasonic oscillating nozzles and an automatic transport system SECS II protocol that supports 0HT/RGV. This is a new development in the Hugle electronic cleaning system with rich experience and technology.

  1. Substrate for epitaxy process.
  2. Substrate for high brightness LED wafer

Spec:

  1. 2″wafer
  2. Spec.-customize

Product Expert

Hunt Lin

Sales Dept. II, Wafer Material Div I
Senior Manager

TOPCO SCIENTIFIC

4F & 6F., No.12, Gongye E. 9th Rd., East Dist., Hsinchu City 300, Taiwan
TEL:(+886-3-564-2132 ext.3452
e-mail:hunt.lin@topco-global.com