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High Pressure Clean System

Introduction

The High Pressure Clean System presses the DIW to 2 Mpa~15 Mpa with a special pump, and reduces the water molecules through a special nozzle, and removes particles and adhesions on the surface of the product in a high-speed and high-quality manner.

Description

◆ Just use the DIW no need to add detergent,high pressure and low flow can achieve ultra-high cleaning performance, which can greatly improve the yield of semiconductor/panel high-end manufacturing processes.
◆ The pump is designed for water self-lubrication, no additional or regular replacement of lubricating oil is required, which can completely avoid the risk of contamination.
◆ Simple construction of system components, small pump size, high mute efficiency, and quick maintenance.
◆ Long life time, few replacement parts, and low overhaul cost.

Spec :

Pump pressure : 2 Mpa~15 Mpa
Filter specifications : source low-pressure side:1.2μm, high-pressure side:1.0μm
Equipment reference size (L 1355mm *W 705mm *H 1570mm)
Also adjust and order according to customer needs.

Product Contact

Sam Liu

Sales Dept.Ⅱ, Mechanical Equipment Div., 3rd Business Unit
Project Manager

TOPCO SCIENTIFIC CO.,LTD.

6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan TEL: (03)564-2132 ext.3684 e-mail: sam.liu@topco-global.com

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