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Argon Annealing Wafer (IG-NaNa)

Introduction

Polished wafer with Nitrogen dopant, and is treated by Argon annealing.

Description

Use:

  1. Flash
  2. LCD Driver IC
  3. FCRAM
  4. DRAM

Spec:

6 inch P type
8 inch P type
12 inch P type

Product Contact

Allen Hung

Sales Dept.Ⅱ, Wafer Material Div., 2nd Business Unit
Senior Manager

TOPCO SCIENTIFIC CO.,LTD.

4F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3402
e-mail: allenym.hung@topco-global.com

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