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Chipcoat

Introduction

It is an insulating material of high purity to seal semiconductor IC.

Description

Flip Chip Underfill
Used in mounting technologies involving direct electrical connections.
Flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.

Chip-on-Film Underfill (COF)
Used for flexible substrates as insulating material used in mounting technologies involving direct electrical connections between IC chips and mounting boards.

CSP/BGA Board Level Underfill (SUF)
Used for filling and sealing spaces by capillary action when doing secondary mounting of Packaged Chips to a Motherboard.

Dam-and Fill Encapsulant
Used for wire bonded device as an electrically insulating material.
Dispensing a high-viscosity dam followed by a low-viscosity fill.

Spec:

Customized specifications are available.

Product Contact

Athena Chang

Electronics Div Ⅰ., 3rd Business Unit
Senior Manager

TOPCO SCIENTIFIC CO.,LTD.

7F.-6, No. 168, Anhe Rd., Xitun Dist., Taichung City 407848, Taiwan (R.O.C.)
TEL: (04)3503-5342 ext.65
e-mail:
athena.chang@topco-global.com

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