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Insulating Materials

Introduction

ChipCoat
High purity insulting materials used for encapsulation of Ics and LSIs.
(Features): Good humidity resistance, good heat cycle resistance, good low stress.

Description

Use:

Flip Chip- Underfill Material
Wire Bondong- Glob Top Material
Tape carrier package (TCP)- Chip Coating Material

Spec:

Underfill: 10g/10cc, 30g/30cc syringe
Glob-top: 50g/30cc syringe
TCP: 75g/55cc syringe

Product Contacts

Athena Chang

Electronics Div Ⅰ., 3rd Business Unit
Senior Manager

TOPCO SCIENTIFIC CO.,LTD.

7F.-6, No. 168, Anhe Rd., Xitun Dist., Taichung City 407848, Taiwan (R.O.C.)
TEL: (04)3503-5342 ext.65
e-mail:
athena.chang@topco-global.com