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Insulating Materials

Introduction

ChipCoat
High purity insulting materials used for encapsulation of Ics and LSIs.
(Features): Good humidity resistance, good heat cycle resistance, good low stress.

Description

Use:

Flip Chip- Underfill Material
Wire Bondong- Glob Top Material
Tape carrier package (TCP)- Chip Coating Material

Spec:

Underfill: 10g/10cc, 30g/30cc syringe
Glob-top: 50g/30cc syringe
TCP: 75g/55cc syringe

Product Contacts

Athena Chang

崇越科技股份有限公司

Sales Dept. I, Advanced Material Div. I, 1st Business Unit
Senior Manager

1F., No.9, Ln. 208, Guo’an 1st Rd., Xitun Dist., Taichung City 40763, Taiwan

TEL:(04)3503-5342 ext.3130
e-mail:athena.chang@topco-global.com