Flip Chip Underfill
Used in mounting technologies involving direct electrical connections.
Flows by capillary action into the gap between an IC chip circuit with conductive bumps and a mounting board by capillary action.
Chip-on-Film Underfill (COF)
Used for flexible substrates as insulating material used in mounting technologies involving direct electrical connections between IC chips and mounting boards.
CSP/BGA Board Level Underfill (SUF)
Used for filling and sealing spaces by capillary action when doing secondary mounting of Packaged Chips to a Motherboard.
Dam-and Fill Encapsulant
Used for wire bonded device as an electrically insulating material.
Dispensing a high-viscosity dam followed by a low-viscosity fill.
Customized specifications are available.