Description
Details:
This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices with excellent low stress, adhesive, and penetration property.
Characteristic:
- Good reliability
- Very low internal stress
- Very small filler
Use：
Protection element
Prevent damage to the external environment (moisture, temperature…)
Spec：
10 c.c.(syringe)
30 c.c. (syringe)
