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Liquid Encapsulation

Introduction

This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices with excellent low stress, adhesive, and penetration property.

Description

Details:

This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices with excellent low stress, adhesive, and penetration property.

Characteristic:

  1. Good reliability
  2. Very low internal stress
  3. Very small filler

Use:

Protection element
Prevent damage to the external environment (moisture, temperature…)

Spec:

10 c.c.(syringe)
30 c.c. (syringe)

Product Expert

Jessica Liu

Sales Dept. I, Advanced Material Div. I, 1st Business Unit
Senior Specialist

崇越科技股份有限公司

No.483, Sec. 2, Tiding Blvd., Neihu, Taipei City 114
TEL:(02)8797-8020 ext.2726
e-mail:jessica.liu@topco-global.com