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Liquid Encapsulation

Introduction

This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices with excellent low stress, adhesive, and penetration property.

Description

Details:

This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices with excellent low stress, adhesive, and penetration property.

Characteristic:

  1. Good reliability
  2. Very low internal stress
  3. Very small filler

Use:

Protection element
Prevent damage to the external environment (moisture, temperature…)

Spec:

10 c.c.(syringe)
30 c.c. (syringe)

Product Expert

Jessica Liu

Sales Dept. I, Advanced Material Div. I, 1st Business Unit
Senior Specialist

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.2726
e-mail: jessica.liu@topco-global.com