Integrative
Capabilities
Quality
Advanced
Production
Execution

OPULENT (TPX)

Introduction

Utilizing the excellent release force and heat resistance of TPX™, it has a wide range of uses as a release film for FPC-based circuit boards and advanced materials.

Description

  • Suitable for any uneven surface.
  • Both Roll to Roll or Sheet to Sheet processes can be shared.
  • Good anti-glue and release force for bonding large copper surfaces.
  • It is easy to remove in hot and cold state.

Spec:

unit : M

Product Contact

Shiaofu Huang

Electronics Div Ⅱ., 3rd Business Unit
Sales Manager

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.3183
e-mail: shiaofu.huang@topco-global.com

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