Description
Use:
- carry and protection in process
- for IC dicing and pick-and-place
Spec:
Width: 400mm
Thickness: 115um
Length: 50M or 100M
UV debonding tape which is used to carry glass, dummy wafer or supporter in high-temperature process of wafer level.
Width: 400mm
Thickness: 115um
Length: 50M or 100M
No.483, Sec. 2, Tiding Blvd., Neihu, Taipei City 114
TEL:(02)8797-8020 ext.3144
e-mail:derrick.liu@topco-global.com