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SELFA Tape

Introduction

UV debonding tape which is used to carry glass, dummy wafer or supporter in high-temperature process of wafer level.

Description

Use:

  1. carry and protection in process
  2. for IC dicing and pick-and-place

Spec:

Width: 400mm
Thickness: 115um
Length: 50M or 100M

Product Expert

Derrick Liu

Sales Dept. II, Electronics Div., 3rd Business Unit
Associate

TOPCO SCIENTIFIC

No.483, Sec. 2, Tiding Blvd., Neihu, Taipei City 114
TEL:(02)8797-8020 ext.3144
e-mail:derrick.liu@topco-global.com