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SEP 300mm Wafer FOUP

Introduction

Shin-Etsu Polymer Front Opening Unified Pod (FOUP)
■ One piece, single mold design.
■ Specified within SEMI standard.
■ Wafer supports without abrasions.

Description

Use:

  1. ■ AMHS capability:
  2. Robust design featuring in automated material handling system operating 8kg payload with overhead transport(OHT), automated-guided vehicle(AGV), person-guided vehicle(PGV).
  3. and forklift conveyors, loadports, storage or stocker shelves and workstations properly working with.

Spec:

Capacity: 25 wafers
Dimension: W426mm*L347mm*H338mm
Weight: 4.6kg
SEMI Std: Compliant(E47.1, E1.9, E15.1, E57, E62 and S8)
Options: Conductive side rails, Bar code & RF ID Tag holder, UV cut window & Card Case.

Product Expert

Stanley Chen

Sales Dept. II, Engineering Integration Div., 5th Business Unit
Senior Manager

崇越科技股份有限公司

4F & 6F., No.12, Gongye E. 9th Rd., East Dist., Hsinchu City 300, Taiwan

TEL:(03)564-2132 ext.3323
e-mail:stanley.chen@topco-global.com