Integrative
Capabilities
Quality
Advanced
Production
Execution

APK/UPK system

Introduction

Auto-packing system is consummated to guide the design of silicon wafer manufacturing equipment to improve the safety, usability and cost saving.

Description

Applies to pack/unpack 8~12 inch wafer for shipping and transferring.

APK (FOSB/FOUP/REEL/POD) :

  • loader/Unloader and inspection module
  • FOSB/FOUP inspection module
  • Wafer mapping & slot overlap inspection function
  • Labeling and Inspection module
  • Film sealing, folding & taping
  • Self-developed vacuum function

UPK (FOSB/FOUP/POD) :

  • RFID writing, reading and interface with MES
  • Automatic tool(Knife) change function
  • Consumables recycle (Including desiccant, packing bag)

Product Contact

Sam Lin

Sales Dept. Ⅲ, Wafer Material Div., 2nd Business Unit
Sales Assistant Manage

TOPCO SCIENTIFIC CO.,LTD.

4F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3413
e-mail: sam.lin@topco-global.com

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