描述
用途:
Flip Chip- Underfill Material
Wire Bondong- Glob Top Material
Tape carrier package (TCP)- Chip Coating Material
規格:
Underfill: 10g/10cc, 30g/30cc syringe
Glob-top: 50g/30cc syringe
TCP: 75g/55cc syringe
ChipCoat
半導體IC封裝用的高純度絕緣材料.
(特點): 耐濕性佳, 耐熱循環性佳,低應力性佳.
Flip Chip- Underfill Material
Wire Bondong- Glob Top Material
Tape carrier package (TCP)- Chip Coating Material
Underfill: 10g/10cc, 30g/30cc syringe
Glob-top: 50g/30cc syringe
TCP: 75g/55cc syringe
40763 台中市西屯區國安一路208巷9號1樓
TEL:(04)3503-5342 ext.3130
e-mail:athena.chang@topco-global.com