Integrative
Capabilities
Quality
Advanced
Production
Execution

SiC reclaim wafer

Introduction

Regardless of poor quality polish SiC wafer, SiC epi wafer, or IC device SiC wafer, the surface defect and device pattern can be removed by claim process, and recover to epi ready quality.

Description

Spec :

We supply 4 inch and 6 inch N-type and semi-insulating SiC wafers. According to customer needs and specifications, thickness, particle, surface metal and etc.. we can provide high quality reclaim wafer.

Product Contact

Jason Wei

Technical Service Dept.
Director

TOPCO SCIENTIFIC CO.,LTD.

4F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3441
e-mail: jason.wei@topco-global.com

提醒

本網站不支援您所使用的瀏覽器

為了提供您最佳的網站體驗,
請您改用下列幾種瀏覽器瀏覽本網站,謝謝您的合作。