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Solder paste

Introduction

Mixture of solder powder, flux and activator. For electric component to be mounted on substrate and PCB.
Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 7.

Description

  • Fit small component and narrow pitch
  • Excellent workability
  • Excellent soldering performance and process yield
  • Low voiding, bridging, tombstoning

Spec :

Jar ( 250g/500g )

Product Contact

Posen Tseng

Electronics Div Ⅱ., 3rd Business Unit
Manager

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.3128
e-mail: posen.tseng@topco-global.com

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