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Thermal Interface Material

Introduction

The material is composed of silicone polymer and thermal conductive fillers, resulting in low modulus material. It is suitable to TIM1 application, providing the good thermal conductive channel between chips and lids.

Description

Soft polymer matrix with high thermal conductive fillers, our silicone-based thermal interface materials can provide your package with high reliability performance and good thermal dissipation.

Spec:

Thermal conductivity > 3.0 w/m·k.
If you have further inquiry, please feel free to contact with us.

Product Contact

Scott Wang

TOPCHEM MATERIALS CORP.
Senior Associate

TOPCHEM MATERIALS CORP.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.2724
e-mail: scott.wang@topco-global.com

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