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Thick Film Photoresist (I-Line)

Introduction

Thick film photoresist, it is designed for special MEMS & CSP application.
I-line photoresist has good absorption ability to 365nm wavelength.

Description

Use:

  1. For plating and Sputtering process.
  2. Dielectric layer, buffer layer and passivation layer for Chip Size Package application.

Spec:

Special designed for each customer.

Product Contact

Gabriel Huang

Sales Dept. I, Advanced Material Div. I, 1st Business Unit
Sales Manager

TOPCO SCIENTIFIC CO.,LTD.

No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.2736
e-mail: gabriel.huang@topco-global.com

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