描述
用途:
Flip Chip- Underfill Material
Wire Bondong- Glob Top Material
Tape carrier package (TCP)- Chip Coating Material
规格:
Underfill: 10g/10cc, 30g/30cc syringe
Glob-top: 50g/30cc syringe
TCP: 75g/55cc syringe
ChipCoat
半导体IC封装用的高纯度绝缘材料.
(特点): 耐湿性佳, 耐热循环性佳,低应力性佳.
Flip Chip- Underfill Material
Wire Bondong- Glob Top Material
Tape carrier package (TCP)- Chip Coating Material
Underfill: 10g/10cc, 30g/30cc syringe
Glob-top: 50g/30cc syringe
TCP: 75g/55cc syringe
40763 台中市西屯区国安一路208巷9号1楼
TEL:(04)3503-5342 ext.3130
e-mail:athena.chang@topco-global.com