News

Topco Scientific Co. Ltd. (Topco) (TAIEX: 5434), the industry leader in integrated services of semiconductor and optoelectronic materials, along with its subsidiary SHUNKAWA CO., LTD, has teamed up with six Taiwanese and U.S. semiconductor suppliers to participate in SEMICON Japan 2024. From December 11 to 13, they will showcase the integrated capabilities of the international semiconductor supply chain platform at Tokyo Big Sight.

Topco combines integrated solutions for materials, equipment, and components, partnering with manufacturers of electronics and semiconductor packaging materials—Indium Corporation, a U.S. company; facilities engineering and precision component integration manufacturer—Chenfull International Co. Ltd (TAIEX: 8383); packaging equipment provider—3S Silicon Tech., Inc. (TAIEX: 5297); semiconductor wet bench process equipment supplier—Grand Process Technology Corp. (TAIEX: 3131); chemical filtration manufacturer—Yesiang Enterprise Co., Ltd; and semiconductor component supplier—Taiwan E&M Systems, Inc., to form a supply chain platform and enter the Japanese market.

Bringing together a supply chain of six Taiwanese and U.S. manufacturers, Topco presents the most complete supply chain lineup at SEMICON Japan, covering equipment, materials, components, and related process manufacturers. Topco will showcase packaging materials such as thermal interface materials, flux, and metal solder for power component packaging from U.S. Indium Corporation; exhaust duct and washing equipment system solutions from Chenfull International Co., Ltd.; wet bench process equipment and single wafer wet process equipment from Grand Process Technology Corp.; chemical filtration solutions for equipment processes from Yesiang Enterprise Co., Ltd., a professional provider of AMC control solutions; and formic acid vacuum reflow equipment from 3S Silicon Tech., Inc., which uses a contact vacuum heating system with precise temperature gradient control for more uniform soldering results and real-time monitoring to track process parameters, providing the optimized process solutions for high-power component manufacturing.

Topco’s subsidiary, Taiwan E&M Systems, Inc., collaborates with customers to develop equipment parts used in advanced semiconductor processes, applied in high-temperature, corrosion-resistant sealing for semiconductor etching, chemical vapor deposition, furnace tubes, and more. Products like quartz rings and silicon electrodes for etching process applications and ceramic PCB for thin-film process applications, will be showcased at SEMICON Japan.

Topco CEO, Mr. Dennis Chen, stated, “Over the past two to three decades, Taiwan’s semiconductor industry has rapidly developed, particularly in advancing cutting-edge processes, establishing Taiwan as a global leader. This has led to a strong and complete semiconductor supply chain ecosystem. Through the supply chain platform roles played by Topco and SHUNKAWA CO., LTD, we assist Taiwanese and U.S. companies in entering Japan’s semiconductor supply chain. Additionally, Topco looks forward to collaborating with local Japanese manufacturers. Kyushu, in particular, has many hidden champion companies with a solid foundation in mature processes, providing services such as second-hand equipment cleaning and refurbishment, which Topco is eager to partner with in the future.”

Topco Scientific (Japan) Co., Ltd. was established in Tokyo in 2006, followed by the founding of SHUNKAWA CO., LTD. in 2022, and the establishment of SHUNKAWA’s Kumamoto office in 2023. By deploying personnel and resources locally, Topco serves semiconductor customers in the Kyushu region, offering services such as semiconductor materials and technology, market analysis, localized assembly, warehousing and logistics, and specialty chemical storage. These efforts will strengthen the resilience of the global supply chain and achieve localized production. Topco Chairman Mr. Jeffery Pan stated, “Japan holds a leading advantage in semiconductor materials and equipment. By combining this strength with Taiwan’s strong technical capabilities in advanced manufacturing processes, we anticipate that the alliances between Japanese and Taiwanese companies will accelerate technological breakthroughs and foster mutual benefits and prosperity for the semiconductor industries in both countries.”

Topco Participates in the SEMICON Japan 2024！December 11-13: Grand Exhibition in Tokyo
▍ Exhibition Information
◆Time: 10:00 – 17:00, December 11-13, 2024
◆Location: Booth No. #7436, East Hall 7, Tokyo Big Sight, Tokyo
◆Products/Services: Front-end wafer manufacturing materials, including quartz rings and silicon electrodes for etching process applications; ceramic PCB for thin-film process applications; packaging materials such as thermal interface materials, flux, and metal solder; precision components for facilities engineering; and wet bench process and packaging equipment, formic acid furnaces, and open laboratory equipment.