Topco Launches Strategic Deployment in Advanced Materials and Packaging Solutions at SEMICON Taiwan 2025
The 2025 SEMICON Taiwan exhibition will take place from September 10th to 12th at the Taipei Nangang Exhibition Center. Topco Scientific (TWSE: 5434, Topco), a leading provider of integrated solutions for semiconductor and optoelectronic materials, will be exhibiting at Hall 1, showcasing its one-stop, full-process integration platform in collaboration with global supply chain partners to expand business opportunities both in Taiwan and overseas.
Topco Scientific showcases its integration capabilities in advanced manufacturing and cutting-edge technologies across four key domains:
◆ Advanced materials and components for semiconductor — Enhancing front-end process yield and stability
◆ Advanced packaging materials for CoWoS and HBM— Addressing diverse demands of high-performance computing and advanced packaging
◆ Forward-looking silicon photonics technology — Seizing opportunities in AI and high-speed computing applications
◆ Equipment and green energy environmental engineering — Supporting customers in achieving low-carbon manufacturing and ESG sustainability
▍Booth information at 2025 SEMICON Taiwan
◆Exhibition Time:10:00 – 17:00, September 10th (Wed.) – 12th (Fri.), 2025 (Closing one hour early on the last day)
◆Location:Booth #K2760, 1F, Taipei Nangang Exhibition Center Hall 1
(No. 1, Jingmao 2nd Rd., Nangang Dist., Taipei)
▍TechXPOT
◆Time:11:00-11:20, September 11th (Thurs.), 2025
◆Location:Booth #X0047, 3F, Taipei Nangang Exhibition Center Hall 2
◆Topic:Wafer & PLP Advance package Anti-Warp Carrier Solution

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Press Contacts
Della Huang
- TOPCO SCIENTIFIC CO.,LTD.
- Senior Deputy General Manager
- Stock Affair Office
Luyi Wu
- TOPCO SCIENTIFIC CO.,LTD.
- Manager
- Marketing & PR Dept.
