News

Topco Scientific Co., Ltd. (TAIEX: 5434), a leading provider of integrated semiconductor and optoelectronic materials solutions, together with its Japanese subsidiary SHUNKAWA CO., LTD., will join 9 semiconductor suppliers from Taiwan, the United States, and Japan to participate at SEMICON Japan 2025. From December 17 to 19 at Tokyo Big Sight, the group will showcase integrated solutions spanning front-end semiconductor processes, power module applications, advanced packaging materials and equipment, and intelligent energy-saving monitoring systems—demonstrating the strength of Topco’s international supply chain platform.

Topco has long cultivated deep expertise in advanced process materials. This year’s exhibit features a comprehensive range of critical materials, components, and equipment covering wafer fabrication through packaging and testing. Participating partners include: U.S.-based manufacturer of electronic and semiconductor packaging materials Indium Corporation; packaging equipment manufacturer 3S Silicon Tech Inc. (TAIEX: 5297); facilities engineering and precision component integration provider Chenfull International Co., Ltd. (TAIEX: 8383); chemical filtration manufacturer Yesiang Enterprise Co., Ltd.; wet-process equipment supplier Grand Process Technology Corporation (TAIEX: 3131); semiconductor component supplier TAIWAN E&M SYSTEMS; Japan-based precision fluid control equipment maker Kuwana Metals, Ltd.; photomask inspection equipment company ACEMACH Co., Ltd.; and energy-consumption monitoring specialist 3Egreen Technology Inc.

Key Materials and Components

Indium Corporation will present high-purity indium sheets, solder preforms, and pressure / pressure-less copper sinter pastes, widely applied in power modules and components requiring high-efficiency thermal management. 3S Silicon Tech’s Formic Acid Vacuum Reflow Oven ensures a clean and high-reliability soldering performance for power devices and power module packaging, ideal for EV and AI Server. It is designed to prevent contamination of both the chip and the vacuum chamber while remaining environmentally friendly by avoiding harmful gas emissions, ultimately achieving superior soldering joint uniformity and excellent thermal performance.

Yesiang Enterprise will showcase its AMC (Airborne Molecular Contamination) filtration solutions for advanced manufacturing processes, with fully customized chemical filters designed to prevent wafer defects and ensure yield enhancement. Kuwana Metals will showcase mass flow controllers (MFCs) featuring high sensitivity, excellent response time, and superior control accuracy. Chenfull International will highlight its process exhaust systems, widely adopted by high-tech fabs globally, offering corrosion-resistant components and integrated scrubber-system performance enhancements. Grand Process Technology will focus on wet-process equipment supporting CPO, 3DIC, CoWoS, and CoPoS applications, demonstrating strengths in heterogeneous integration and advanced packaging technologies.

Topco’s subsidiary TAIWAN E&M SYSTEMS collaborates with customers to develop components for high-end semiconductor manufacturing. The company will exhibit perfluoroelastomer O-rings, quartz gas nozzles, ceramic rings, and other precision parts essential for etching and thin-film deposition processes.

Advanced Inspection & Energy Monitoring Solutions

In inspection equipment, ACEMACH—will feature its photomask inspection systems covering mature nodes through 3nm advanced processes. Its high-precision automated optical inspection technology eliminates inconsistencies inherent in manual inspection, significantly enhances yield and equipment uptime, and reduces operating costs. With outstanding technological performance and proven system stability, ACEMACH has successfully entered tier-one global semiconductor supply chains, underscoring its competitiveness in advanced inspection.

In addition, one of the major highlights of this exhibition is SHUNKAWA’’s presentation of 3Egreen Technology’s integrated energy management system, showcased in response to the global trend toward energy conservation and carbon reduction. The featured product, the Smart Clamp Meter, leverages AIoT technology to support manufacturing facilities in real-time monitoring of energy consumption and identifying opportunities for improved energy efficiency. All energy usage data and operational patterns are comprehensively recorded and stored, enabling further analysis of electricity consumption to accurately track carbon emission footprints and uncover meaningful pathways for effective energy-saving initiatives.

Strengthening Japan–Taiwan Semiconductor Collaboration

Topco established SHUNKAWA CO., LTD. in 2022 and has since expanded operations in Tokyo and Kumamoto. Topco Scientific’s CEO, Mr. Dennis Chen, stated: “Japanese suppliers have always played an essential and irreplaceable role in semiconductor process materials, while Taiwan leads the world in advanced wafer manufacturing. The collaboration between Taiwan and Japan is highly complementary and mutually reinforcing. Through Topco’s international supply chain platform, we aim to help Taiwanese semiconductor suppliers enter major Japanese customers such as Renesas, Kioxia, Mitsubishi, and Sony, while continuing to explore high-quality Japanese products to Taiwan. At the same time, as Japan accelerates the application of AI and data-center development, Topco will continue to cultivate new business opportunities.”

Topco Participates in the SEMICON Japan 2025！December 17-19: Grand Exhibition in Tokyo
▍Exhibition information
◆Time: 2025/12/17 (Wed) – 12/19 (Fri) 10:00 – 17:00, a total of 3 days
◆Location: Booth No. #W3312, West Exhibition Halls, Tokyo Big Sight, Tokyo
◆Products/Services: Advanced semiconductor front-end process materials and parts, Materials and equipment for power modules and advanced packaging, Intelligent energy-saving monitoring systems and components