Dr. Kuo's Column

2023 SEMICON Taiwan is set to take place from September 6th to 8th at Taipei Nangang Exhibition Center. Topco Scientific (TOPCO), a leading integrated service provider of critical semiconductor and optoelectronic materials, will showcase its comprehensive semiconductor supply chain solutions on the 4th floor of Hall 1. TOPCO will exhibit semiconductor integration services, front-end semiconductor manufacturing processes, advanced back-end packaging and high-performance substrates, pre-owned equipment and spare parts services, as well as comprehensive solutions for plant construction and factory management systems.

To demonstrate its strong capabilities in the integrated semiconductor supply chain, TOPCO is planning to exhibit across two major exhibition areas. The first will showcase the advantages of semiconductor integration services and front-end semiconductor manufacturing processes, including featured products such as silicon wafers, wafer carriers, quartz tubes used in diffusion processes, EUV photoresists for photolithography, photomask substrates, photomask pellicles, specialty chemicals for thin film and etching processes, slurry and polishing pads for CMP processes, chemicals for cleaning processes, equipment and components. This aptly demonstrates TOPCO’s deployment of a comprehensive supply chain platform for semiconductor front-end processes. Additionally, TOPCO will focus on seizing opportunities in the third-generation semiconductor market by establishing its presence in new gallium nitride substrate technologies. On September 7th, at the TechXPOT stage of SEMICON Taiwan, TOPCO is set to present the topic “Composite Substrates Enabling True GaN World” and introduce the GaN on QST (Qromis Substrate Technology) technology.

In response to the emergence of AI and high-speed computing applications, which are driving the demand for CoWoS and 3D IC advanced packaging capacities, TOPCO will showcase its integrated solutions and featured products for semiconductor advanced packaging processes and high-performance substrates in the second major exhibition area. Apart from presenting packaging process materials such as die attach film, packaging adhesives, packaging protective films and heat sinks, the exhibit will also highlight key materials like quartz cloth, resins and electroplating solutions used in high-performance substrates. Additionally, the exhibit will present “Plating Chemical Products for Advanced Packaging Process,” offering a solution for metal wiring in advanced semiconductor packaging processes, aiming to capture opportunities in advanced packaging and high-performance substrate markets. Furthermore, TOPCO will also exhibit immersion cooling equipment, providing the optimal solution for heat dissipation challenges in high-speed computing and data center applications.

Considering that the topics of carbon neutrality and net-zero carbon emissions have become focal points for sustainable business operations, TOPCO is also showcasing comprehensive solutions for facility construction and factory management systems in the second exhibition area, including assisting semiconductor and optoelectronic foundry customers with overall facility planning, construction, facility system engineering, green energy, and circular economy services. TOPCO has long invested in the research and development of wastewater treatment technologies and products compliant with the latest environmental regulations, which it hopes can address wastewater treatment challenges faced by high-tech plants, successfully developing wastewater treatment and recycling systems, cleanroom engineering, green chemicals and other environmental and facility engineering solutions. Additionally, TOPCO offers assistance in environmental assessment and monitoring services, carbon inventory and sustainable green energy services.

TOPCO offers customers a seamless and convenient one-stop services to its customers, encompassing ASIC design outsourcing, semiconductor fab outsourcing, packaging and testing, photomask procurement, IP integration and expert engineering consultation, streamlining the product manufacturing cycle for clients through holistic services. Additionally, we provide integrated solutions for third-generation semiconductor components, catering to high-performance power ICs, such as SiC and GaN, which includes everything from material substrates to wafer fabrication and packaging testing, aiding clients in swiftly responding to market trends. With years of proven success and technological prowess, TOPCO has developed a comprehensive service ecosystem across Taiwan, Japan, China and Southeast Asia. TOPCO has to date served over 200 IC design companies and fab clients.

In response to the decentralization and shifts in global supply chains, TOPCO has actively expanded its presence overseas, seeing to create an international semiconductor supply chain platform. Apart from its operations in China, the company has established subsidiaries in the United States and Japan to provide enhanced customer services closer to customer sites. In Southeast Asia, it has established offices in Singapore, Malaysia and Vietnam to serve customers in the ASEAN region, catering to localized production needs.

“We offer warehousing logistics, technical services, market analysis, storage for specialty chemicals, foreign exchange services, and more,” said Jeffery Pan, Chairman of TOPCO, “We look forward to converging both domestic and international supply chain partners to jointly expand across the global market.”

Topco Scientific Joins 2023 SEMICON Taiwan at Nangang Exhibition Center, September 6th -8th
▍Booth information at 2023 SEMICON Taipei
◆Time: 10:00 – 17:00, September 6th -8th, 2023
◆Location: Booth#M1138 & M1148, 4F, Hall 1, Taipei Nangang Exhibition Center (No. 1, Jingmao 2nd Rd., Nangang Dist., Taipei)

▍TechXPOT
◆Time: PM 13:40-14:00 / 15:00-15:20, September 7th, 2023
◆Location：Booth#L1100, 4F, Hall 1, Taipei Nangang Exhibition Center
◆Topic：
13:40-14:00 Composite Substrates Enabling true GaN world : QST
15:00-15:20 Plating Chemical Products for Advanced Packaging Process