UV Releasing Tape : SELFA Series
- Enabling new semiconductor process by incorporating proprietary heat resistance and debonding technology.
- For protecting devices from heat process during assembly and packaging.
Production Intro
- UV release tape that achieve strong adhesion and easy peeling.
- N2 Gas is generated between the tape and the adherend by UV irradiation, and it can be easily peeled off with No adhesion, making it possible to process thinly polished wafers without damage.
- We will propose the optimal grade from a wide lineup such as single-sided HS with high heat resistance, HW for Glass Carrier Support System, MP with excellent chemical resistance.
Spec
- Can be adjusted according to customer’s needs.
Product Contact
Ray Peng
- TOPCO SCIENTIFIC CO.,LTD.
- Assistant Manager
- Electronics Div Ⅱ., 3rd Business Unit
6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3677
