UV Releasing Tape : SELFA Series
- Enabling new semiconductor process by incorporating proprietary heat resistance and debonding technology.
- For protecting devices from heat process during assembly and packaging.
Production Intro
Product Contact
Ray Peng
- TOPCO SCIENTIFIC CO.,LTD.
- Project Manager
- Electronics Div Ⅱ., 3rd Business Unit
6F., No. 12, Industry E. 9th Rd., Science based Industrial park, Hsinchu City 300096, Taiwan
TEL: (03)564-2132 ext.3677