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The 2025 SEMICON Taiwan will be held in grand scale from September 10–12, with Topco Scientific (TWSE: 5434) making a remarkable appearance at Hall 1 of the Nangang Exhibition Center. In response to the surging demand from AI and HPC applications, Topco will highlight advanced process and CoWoS packaging materials, along with silicon photonics technologies, and provide end-to-end supply chain solutions that span wafer fabrication to packaging and testing — covering materials, components, and equipment.

 

Topco continues to strengthen its market leadership in advanced materials, including photoresists, wafers, quartz products, and slurries, while also developing adhesives, films, and carriers required for advanced packaging processes. These offerings help semiconductor and packaging manufacturers improve yield and stability, reflecting Topco’s forward-looking deployment in advanced manufacturing and emerging technologies, Topco also provides one-stop solutions — from design to fab construction — enabling customers to achieve low-carbon manufacturing and expand globally in partnership with Topco.

 

 

As CoWoS and High Bandwidth Memory (HBM) packaging technologies rapidly evolve, Topco is actively expanding its portfolio of advanced materials to support higher efficiency and yields in packaging. Chairman Mr. Jeffery Pan noted: “From sapphire substrates for CoWoS processes, to underfill materials for advanced packaging, temporary bonding materials for HBM, and indium sheets, Topco has built a comprehensive portfolio in the advanced packaging sector, which has earned strong recognition from the market.”

 

Among these, sapphire substrates stand out as a major highlight at the show. On September 11 at 11:00 AM, Topco will present “Wafer & PLP Advance package Anti-Warp Carrier Solution” at the TechXPOT stage, Hall 2, 3F. As chip sizes increase, traditional glass carriers often fail to provide sufficient strength, leading to wafer warpage and yield loss. Sapphire substrates, with six times the strength of glass and high optical transmittance, meet the demanding requirements of Panel-Level Packaging (PLP), delivering outstanding stability.

 

In the area of packaging materials, Topco presents solutions designed for CoWoS applications, emphasizing high yield, superior heat resistance, and outstanding stability. Among these innovations, underfill materials significantly strengthen the mechanical bond between the chip and substrate, preventing solder joints from damage caused by thermal stress or external forces and thereby enhancing the overall reliability of packaged devices. Topco also introduces molded underfill (MUF), which allows chip encapsulation and underfill to be completed in a single step during the packaging process. This integration reduces thermal stress from mismatched coefficients of thermal expansion between the chip and substrate, providing better structural support and protection while improving both reliability and production efficiency. In addition, Topco’s temporary bonding and debonding (TBDB) materials enable wafers to be securely attached to rigid carriers during processing. This reduces wafer warpage and effectively protects delicate microbumps from potential damage, ensuring process stability and product quality.

 

Thermal management solutions are also a key highlight of Topco’s exhibition. The company offers high-purity indium sheets from U.S.-based Indium Corporation, with a thickness of up to 100 microns. Thanks to their low melting point, these indium sheets serve as a superior alternative to traditional thermal interface adhesives, conforming closely to heat spreaders and eliminating air gaps that contribute to thermal resistance. This ensures greater stability and reliability in chip operation. Furthermore, Topco has introduced highly stable electroplating solutions that have already entered the supply chains of leading international semiconductor manufacturers, further reinforcing the company’s competitive edge in the advanced packaging materials market.

 

To support high-frequency signal transmission in AI servers, Topco introduces quartz cloth featuring excellent heat resistance, a low dielectric constant, low loss, and superior stability, meeting the substrate requirements for high-frequency data transfer. CEO Mr. Dennis Chen commented: “The AI server upgrade cycle is fueling the growth of high-end PCB manufacturing. Compared to glass fiber cloth, quartz cloth performs better in high-frequency, high-speed applications with lower signal loss. We anticipate explosive growth in this market by 2027.”

 

 

With the rapid rise of AI and HPC, demand for high-speed data transmission has surged, while traditional electronic interconnects face bottlenecks in bandwidth and power consumption. Silicon photonics has emerged as a key solution to overcome these challenges.

 

To address the biggest challenge in silicon photonics packaging — precise alignment between chips and optical fibers — Topco provides fiber coupling equipment that improves coupling stability, mass production efficiency, and packaging yields. The company is working closely with foundries, research institutes, and OSATs to accelerate commercialization of next-generation optical communication modules and AI chips. In parallel, nanoimprint technology — offering high resolution, low cost, and precise alignment — supports the mass production of Metalenses, silicon photonic devices, and high-speed communication modules, backed by Topco’s robust optical design capabilities.

 

On the materials side, Topco will exhibit 12-inch silicon optical waveguide substrates, which integrate optical transceivers, modulators, photodetectors, and driver circuits on a single chip. These substrates are essential building blocks for silicon photonics, laying a solid foundation for future high-speed computing and optical communication.

 

 

In addition to showcasing breakthroughs in materials technology, Topco highlighted its comprehensive eco-friendly and low-carbon solutions at the exhibition, spanning facility engineering to sustainable services. Among the key innovations was the “Organic sludge zero-discharge equipment” system, designed to decompose and process semiconductor plant sludge waste, ultimately achieving true zero discharge. Topco also introduced one of the market’s most advanced energy-saving solutions — the “Refrigerant Optimizer” for water-cooled air conditioning systems. This innovation effectively mitigates refrigerant clustering, greatly improves heat exchange efficiency, and delivers remarkable energy-saving performance. Additionally, Topco presented its cutting-edge laser cleaning technology, which effectively cleans metallic and graphite components in semiconductor fabs without producing acidic or alkaline wastewater. Together, these solutions reflect Topco’s commitment to supporting its customers in advancing toward green manufacturing.

 

With decades of expertise in fab facility engineering — from cleanroom construction, wastewater treatment, and HVAC systems to full-scale facility projects — Topco has built a strong track record in Singapore, Vietnam, Malaysia, and beyond. Chairman Mr. Jeffery Pan emphasized: “Topco has become the preferred partner for customers’ overseas fabs. Projects with VSMC, Micron, and other major international players are progressing steadily. These achievements continue to contribute to stable revenue momentum, and we anticipate further growth in both revenue and profit throughout 2025.”

 

 

◆Exhibition Time：10:00 – 17:00, September 10th (Wed.) – 12th (Fri.), 2025 (Closes one hour early on the last day)

◆Location：Booth #K2760, 1F, Taipei Nangang Exhibition Center Hall 1
(No. 1, Jingmao 2nd Rd., Nangang Dist., Taipei)

 

◆Time：11:00-11:20, September 11th (Thurs.), 2025

◆Location：Booth #X0047, 3F, Taipei Nangang Exhibition Center Hall 2

◆Topic： Wafer & PLP Advance package Anti-Warp Carrier Solution