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With the rapid rise of artificial intelligence (AI) and high-performance computing (HPC), advanced packaging is evolving toward larger dimensions, higher performance, and high-density heterogeneous integration. At the same time, structural and thermal warpage in packaging have become an increasingly critical challenge. Topco Scientific (TWSE: 5434, Topco) announced that it will present its latest “Wafer & PLP Advance Package Anti-Warp Carrier Solution” at the 2025 SEMICON Taiwan Technical Seminar. The presentation will take place on September 11 at 11:00 a.m., at the TechXPOT stage, 3F of Hall 2 at the Taipei Nangang Exhibition Center.

Warpage has long been a pain point in advanced processes. Layers including the die, substrate, underfill, interposer, and capping layer are highly prone to stress accumulation caused by mismatched coefficients of thermal expansion (CTE), curing shrinkage, and structural asymmetry. Additional stress during bonding, molding, thermo-compression, and reflow can lead to deformation, jeopardizing both process stability and product reliability. To address these challenges, Topco has developed an anti-warpage carrier solution, leveraging proven technology and a resilient supply chain to strengthen Taiwan’s role as a leader in the global semiconductor industry.

At the core of this solution is Topco’s newly introduced sapphire single-crystal substrate. With its exceptional rigidity, high melting point, and superior wear resistance, sapphire effectively mitigates warpage issues. It also offers over 85% transmittance across both ultraviolet and infrared wavelengths, making it highly adaptable for a variety of debonding processes and ideal for future Panel-Level Packaging (PLP) applications. “Compared with conventional glass carriers, sapphire provides the strength required to address warpage in advanced packaging and enhance process stability. Topco is currently the sole company in Taiwan supplying sapphire single-crystal substrates with superior rigidity,” said Dennis Chen, CEO of Topco.

Building on years of expertise in semiconductor materials and equipment, Topco has worked closely with leading global companies to introduce cutting-edge packaging solutions. At this year’s SEMICON Taiwan, Topco will showcase sapphire ingots, 12-inch single-crystal substrates, and square substrates in multiple specifications, underlining its diversified product portfolio.

In addition to sapphire, Topco offers a full spectrum of substrate solutions tailored to different packaging needs, including sapphire substrates that provide superior warpage control and high-temperature stability, cost-efficient glass substrates, and silicon substrates designed to match the thermal expansion properties of the die. As customers accelerate overseas expansion, Topco continues to leverage its localized services and global supply chain platform to deliver optimized materials, empowering customers to maintain their competitive edge in the global marketplace.

▍TechXPOT
◆Time：11:00-11:20, September 11th (Thurs.), 2025
◆Location：Booth #X0047, 3F, Taipei Nangang Exhibition Center Hall 2
◆Topic：Wafer & PLP Advance Package Anti-Warp Carrier Solution

▍Booth information at 2025 SEMICON Taiwan
◆Exhibition Time：10:00 – 17:00, September 10th (Wed.) – 12th (Fri.), 2025 (Closes one hour early on the last day)
◆Location：Booth #K2760, 1F, Taipei Nangang Exhibition Center Hall 1
(No. 1, Jingmao 2nd Rd., Nangang Dist., Taipei)

▍Support Contact
Technical Support ─ Mr. Will Chen, T: +886-3-564-2132#2861 E: will.chen@topco-global.com
Press Contact ─ Ms. Luyi Wu, T: +886-2-8797-8020#2626 E: luyi.wu@Topco-global.com