Chipcoat
It is an insulating material of high purity to seal semiconductor IC.
Production Intro
Use：
- Flip Chip Underfill
- Dam-and Fill Encapsulant
- CSP/BGA Board Level Underfill (SUF)
- Chip-on-Film Underfill (COF)
Spec
- Customized specifications are available.
Product Contact
Athena Chang
- TOPCO SCIENTIFIC CO.,LTD.
- Senior Manager
- Electronics Div Ⅰ., 3rd Business Unit
7F.-6, No. 168, Anhe Rd., Xitun Dist., Taichung City 407848, Taiwan (R.O.C.)
TEL: (04)3503-5342 ext.65
