Cu pillar & Mass array solution

1. Cu pillar have high thermal-conductivity, high electric conductivity as effective conducting material in high level semi-packaging.
2. Cu pillar apply in semi-packaging as I/O connection could enhance the mobility of under-fill.
3. High ratio (length/diameter) pillar could replace Cu-plating, fine solder ball by better processing-cost benefit.
4. 窄間距I/O產品，銅柱成為增加底部填充材流動速度的應用材料。

Spec

• Minimum diameter : 70 um
• Maximum length : 1 mm
• Surface coating(1~15 um) : Ni、Au、Sn