Cu pillar & Mass array solution
半導體封裝導電柱
半導體封裝抗EMI導電柱
半導體高gap支撐柱
半導體高長度/直徑比導電柱
Production Intro
- Cu pillar have high thermal-conductivity, high electric conductivity as effective conducting material in high level semi-packaging.
- Cu pillar apply in semi-packaging as I/O connection could enhance the mobility of under-fill.
- High ratio (length/diameter) pillar could replace Cu-plating, fine solder ball by better processing-cost benefit.
- 窄間距I/O產品，銅柱成為增加底部填充材流動速度的應用材料。
Spec
- Minimum diameter : 70 um
- Maximum length : 1 mm
- Surface coating(1~15 um) : Ni、Au、Sn
Product Contact
Kim Lin
- TOPCO SCIENTIFIC CO.,LTD.
- Project Manager
- Electronics Div Ⅰ., 3rd Business Unit
No. 483, Sec. 2, Tiding Blvd., Neihu Dist., Taipei City 114511, Taiwan
TEL: (02)8797-8020 ext.2832
