Liquid Encapsulation
This is a liquid epoxy resin encapsulating material for the protection and adhesion of semiconductor devices with excellent low stress, adhesive, and penetration property.
Production Intro
Characteristic
- Good reliability
- Very low internal stress
- Very small filler
Use：
- Protection element
- Prevent damage to the external environment (moisture, temperature…)
Spec
- 10 c.c. (syringe)
- 30 c.c. (syringe)
Product Contact
吳仁棋
- 崇越科技股份有限公司
- 專案經理
- 應產營一部
114064 台北市內湖區洲子街 176 號 7 樓
TEL: (02)8797-8020 ext.2855
