Epoxy Mold Compound for IC Packaging
Epoxy resin is a polymer thermosetting material, mainly used for IC and passive component packaging to protect internal chips from environmental damage and have an insulating effect.
With low stress, high heat dissipation characteristics.
Production Intro
Use：
- For IC Package encapsulating.
- Diode Encapsulation
- Transistor package
Spec
- 15kg/can
- Low temperature storage: below 5 degrees Celsius
Product Contact
吳仁棋
- 崇越科技股份有限公司
- 專案經理
- 應產營一部
114064 台北市內湖區洲子街 176 號 7 樓
TEL: (02)8797-8020 ext.2855
